Influence of stress and temperature on damping behavior of amorphous Pd₇₇.₅Cu₆.₀Si ₁₆.₅ below Tg.

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Output type: Journal article

Author list: Schwabe, Bedorf, Samwer

Publisher: Springer

Publication year: 2011

Volume number: 34

Issue number: 9

ISSN: 1292-8941

eISSN: 1292-895X

Languages: English-Great Britain (EN-GB)

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Open access status: hybrid

Full text URL: https://link.springer.com/content/pdf/10.1140/epje/i2011-11091-x.pdf

Abstract

In this work we analyzed the mechanical damping behavior of amorphous Pd(77.5)Cu(6.0)Si(16.5) below the glass transition temperature (T(g)) with creep/recovery measurements. Here a correlation between temperature stimulation and external stress is found in an exponential, multiplicative way. This demonstrates that not only is the yield stress of the material influenced by temperature variation (mechanical melting) but also the secondary relaxation is modified under stress and temperature.

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